Imaging sensors detecting visible lights, X-rays and charged particles require
innovations such as in sensitivity enhancement by hybridization of different materials, large-scale integration of fine size pixels, high-speed image transfer, and dynamic-range improvement for next stage applications in scientific, medical and industrial areas.
One of the promising solutions is a 3D integration technology stacking different materials/chips vertically. This workshop is organized under a TIA-Kakehashi program “3D semiconductor quantum imaging sensor” (KEK-AIST-U Tokyo-U Tsukuba) to discuss directions of research activities with presentations on latest 3D integration technology and quantum imaging sensor technology.
【date】 Jan 27, 2020 (Mon) 13:30～17:30
【venue】 Tsukuba EPOCAL
【registration fee】 free
【online registration】by Jan 23 , 2020 (Thu) at
http://rd.kek.jp/project/soi/TIA20/2001_TIA3D.html
(on the day registration is possible)
